b) A Glow Wire Flammability Index (GWFI) above 850 deg C per IEC 6 and hence complies with the requirements set out in the International Standard IEC 60335-1 5th edition - household and similar electrical appliances - safety, section 30 Resistance to heat and fire. High Vibration Application This Molex product is manufactured from material that has the following ratings, tested by independent agencies: a) A Glow Wire Ignition Temperature (GWIT) of at least 775 deg C per IEC 6. The SFP+ Interconnect System is scheduled to launch in Spring 2007 and is currently being sold in custom designs only.6.35mm Pitch MLX Power Connector Header, Pin Terminals, 2.13mm Contact Diameter, Vertical, with Plastic Polarizing Peg, 6 Circuits, Lead-Free, White, Glow-Wire Capable With similar mechanical dimensions to a standard SFP cable, the cables are interchangeable with older SFP designs to give customers the flexibility to gradually increase the capabilities of their existing systems. Additionally, the SFP+ Patch Cables offer an EMI girdle for superior EMI performance up to 10 Gbps data transmission. A re-designed pull latch allows easy access to delatch the cable from the connector for belly-to-belly use and ensures the highest possible port density. I2C interface and on-board EEPROM enables the host to detect/configure for specific performance characteristics to provide LOS and Transmit disable, as well as offer a number of other host management capabilities. Optional active circuitry requires no special driver circuitry that optical modules would require. The active cables appear to a host system as an optical module to reduce costs. The Molex copper SFP+ Patch Cables are available in active and passive designs to provide design flexibility for up to 10 Gbps at up to 22m. The SFP+ Stacked Multi-Port Connector features press-fit termination to the PCB, which eliminates the need for soldering, lowers applied costs and avoids solder-related issues. These connectors are used with SMT LEDs to provide the user activity feedback and port status.Ĭustomers can also choose from two options for superior EMI shielding, either a shroud with an elastomeric gasket or a metal gasket with EMI fingers. The connectors integrate 2, 4, 8, 10 or 12 SFP+ ports and lightpipes into one assembly for increased port density and reduced assembly labor. They measure 25.50mm (1.39″) in height and provide two rows of belly-to-belly vertically stacked SFP+ ports to ensure easy removal of the module from the port. The SFP+ stacked multi-port connectors offer complete integration of the connector within a cage. Optional rear or side mounted light pipe cover assemblies allow for flexibility of PCB signal routing for LEDs.Ī high speed contact wafer design allows the SFP+ stacked multi-port connectors to support speeds up to 10 Gbps. The press-fit tails accommodate belly-to-belly applications for both single and ganged cages to ensure the best use of PCB real estate. In addition to a 20-circuit host connector, stacked multi-port connectors and active and passive patch cables, the SFP+ Interconnect System offers single and single layer ganged cages that provide customers with options to make the best use of PCB real estate to meet their design needs.Īvailable in press-fit, solder post and PCI versions, they offer customers a flexible solution for use with various board thicknesses and assembly processes, and ultimately lower applied cost. It is also well-suited for networking, storage and telecommunications applications. The SFP+ Interconnect System was developed to support applications for 8-Gbps Fibre Channel and 10-Gbps Ethernet. “The high density, compact SFP+ Interconnect System delivers excellent signal integrity as well as superior EMI containment to meet a variety of 10 Gbps application needs.” “The Molex SFP+ Interconnect System was specifically designed to address cost, power and size issues,” said Dave Stevenson, product manager, Molex Incorporated. It also occupies 30 percent less space than a standard XFP system, offering a higher data density solution than standard SFP and XFP products. This complete solution meets the next generation Small Form Factor (SFF) 8431 specification and reaches 10 Gbps speeds using the same port space as a standard SFP system. Molex announced the development of the SFP+ Interconnect System.
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